Senior Customer Service Representative jobs

Manage Customer production order releases inclusive weekend support if require

Drive Customer Service Index to improve operational indices for customers.

Purchase Order Management. Acknowledge purchase orders within 24 hours, maintain/cancel redundant purchase orders and ensure correct shipping address. Ensure there is always an active purchase order with pricing in SAP setup by Account Manager.

Assist Account Manager with customer’s material liability (EXOB – Excess and Obsolescence) to minimize STATS ChipPAC revenue exposure.

Analyze WIP projection daily & highlight any potential issues in missing daily shipment commit with actively alerted customer & handle customer request/complaints in a timely manner, actively and reasonably resolve them, control the deterioration of the situation, improve customer satisfaction.

Meet or exceed forecasted revenue. Ensure production and service billings and invoiced promptly with minimal debit / credit notes.

Handle with Shipping on inbound/outbound requests.

Make arrangements for customer visits and maintain good relationships with customer

Required Experience and Qualifications

(Required knowledge, skills and experience---however acquired):

Diploma and/or Degree graduate in any discipline.

Preferably experienced in the area of Customer Service & Planning in manufacturing environment.

Possess good interpersonal and communication skills.

Possess problem solving capability.

Join a leader in the industry!

STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.

Join us and expand your world.